Precision Cleaning

Precision Cleaning
Precision cleaning of semiconductors is a high-precision technology that removes impurities, dust, organic substances, and other contaminants from the surfaces of semiconductor parts. It is crucial for ensuring the quality and performance of these parts.

Cleaning Method

01. Ultrasonic Cleaning

02. Acid-base Soaking and Cleaning

03. High-Pressure Waterjet

04. Sandblasting

05. Dry Ice

Cleaning Advantages

Customer-centric, building exceptional business.

High-Purity Water

The electrical resistance of the pure water throughout the entire process is ≥18 megohms.

Assignment Section

TF, DiFF, ETCH, and other different process refinement partitioning operations.

Full-process control of process parameters

Each operational process is traceable, enabling continuous optimization of production methods.

Highly automated

After completing operations such as immersion washing and drying, the unit automatically lifts and cools down.

Service Models

Etching

PH

IMP

TF

Diffusion DF

Mattson TEL LAM
GRID DRM、SCCM、VIGUS Kiyo、Kiyo45、Syndion、Versys Metal、Flex
TEL    
PIQ Chamber    

POLYMIND CUP

ACT-12 CUP

    
Applied SMIT Axcelis
VIISta 900XP MC3- II/GP Purion XE
VIISta3000XP MC4-II/GP Purion XE
Applied ULVAC NARUA
Versa-TTN TA AX30 AL
HOT AL CU H630
TEL NAURA Kokusai
INDY PLUS THEORIS 302 TRIAS
FORMULA FLOURIS 201 SOD-CUP

Precision Cleaning Sample Display

ETCH

Baffle

Lower Electrode Insulation Ring-C

Compression ring

Upper showerhead

Quartz Ring 200mm

Quartz-based ring

Flat Rectifier Plate (240)_MC

Lower Ceramic Bucket (345-1954) HP+

Base Tray (r6)

Sealing metal ring (r6)
Focus on continuous parts clean exploration and research in semiconductor field

Online Consultation
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Online Consultation